samsung_sm8750/android_kernel_samsung_sm8750
1
0
Fork 0
Code Issues Pull Requests Actions Packages Projects Releases Wiki Activity

iio: temp: maxim-thermocouple: Fix potential lack of DMA safe buffer.

Browse Source 
[ Upstream commit f79aeb6c631b57395f37acbfbe59727e355a714c ]

The trick of using __aligned(IIO_DMA_MINALIGN) ensures that there is
no overlap between buffers used for DMA and those used for driver
state storage that are before the marking. It doesn't ensure
anything above state variables found after the marking. Hence
move this particular bit of state earlier in the structure.

Fixes: 10897f3430 ("iio: temp: maxim_thermocouple: Fix alignment for DMA safety")
Reviewed-by: David Lechner <dlechner@baylibre.com>
Link: https://patch.msgid.link/20250413103443.2420727-14-jic23@kernel.org
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Signed-off-by: Sasha Levin <sashal@kernel.org>
This commit is contained in:
Jonathan Cameron
2025-04-13 11:34:36 +01:00
committed by Greg Kroah-Hartman
parent 2b58e7c1e4
commit 85d430aef4
1 changed files with 1 additions and 1 deletions
Download Patch File Download Diff File Expand all files Collapse all files

2
drivers/iio/temperature/maxim_thermocouple.c
View File

@@ -121,9 +121,9 @@ static const struct maxim_thermocouple_chip maxim_thermocouple_chips[] = {
struct maxim_thermocouple_data {
struct spi_device *spi;
const struct maxim_thermocouple_chip *chip;
char tc_type;
u8 buffer[16] __aligned(IIO_DMA_MINALIGN);
char tc_type;
};
static int maxim_thermocouple_read(struct maxim_thermocouple_data *data,