e2fe040035
Add bindings for thermal devices on Sun Soc, converted to YAML format. Change-Id: Ie5c39b55055c8f4e2a581128afdc45399cfb0c31 Signed-off-by: Rashid Zafar <quic_rzafar@quicinc.com>
42 lines
1.1 KiB
YAML
42 lines
1.1 KiB
YAML
# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
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%YAML 1.2
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---
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$id: http://devicetree.org/schemas/thermal/qti-cpufreq-cdev.yaml#
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$schema: http://devicetree.org/meta-schemas/core.yaml#
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title: Qualcomm Technologies, Inc. CPU Frequency Cooling Device
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maintainers:
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- Rashid Zafar <quic_rzafar@quicinc.com>
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description: |
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The CPU frequency cooling device will be used by userspace thermal daemon to
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vote for frequency cap under thermal conditions. This driver will register a
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cooling device for each CPU phandle specified in the devicetree.
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properties:
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compatible:
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const: qcom,cpufreq-cdev
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qcom,cpus:
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$ref: "/schemas/types.yaml#/definitions/phandle-array"
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description: |
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Cooling device node where we list phandles to the CPUs.
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Each CPU will be registered as a separate cooling device
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with thermal framework.
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required:
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- compatible
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- qcom,cpus
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additionalProperties: false
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examples:
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- |
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#include <dt-bindings/interrupt-controller/arm-gic.h>
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qcom,cpufreq-cdev {
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compatible = "qcom,cpufreq-cdev";
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qcom,cpus = <&CPU0 &CPU4 &CPU7>;
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};
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