Files
android_kernel_samsung_sm87…/bindings/thermal/qti-ddr-cdev.yaml
Rashid Zafar e2fe040035 dt-bindings: thermal: Add bindings for thermal devices
Add bindings for thermal devices on Sun Soc, converted to YAML
format.

Change-Id: Ie5c39b55055c8f4e2a581128afdc45399cfb0c31
Signed-off-by: Rashid Zafar <quic_rzafar@quicinc.com>
2023-09-15 14:55:45 -07:00

70 lines
1.9 KiB
YAML

# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
%YAML 1.2
---
$id: http://devicetree.org/schemas/thermal/qti-ddr-cdev.yaml#
$schema: http://devicetree.org/meta-schemas/core.yaml#
title: Qualcomm Technologies, Inc. DDR Cooling Device
maintainers:
- Rashid Zafar <quic_rzafar@quicinc.com>
description: |
The DDR cooling device will be used to place a DDR frequency vote. This
cooling device will be used in those cases where all the subsystem's are
thermally throttled and DDR has to be operated with a minimum performance
level. This cooling device vote can ensure the same.
properties:
compatible:
const: qcom,ddr-cooling-device
qcom,freq-table:
$ref: /schemas/types.yaml#/definitions/uint32-matrix
description: |
List of available DDR frequencies.
qcom,bus-width:
description:
Provides the bus width for DDR.
$ref: /schemas/types.yaml#/definitions/uint32
enum: [1, 4, 8]
default: 4
"#cooling-cells":
const: 2
description: |
Must be 2. Needed for of_thermal as cooling device identifier.
Please refer to <devicetree/bindings/thermal/thermal.txt> for
more details.
interconnects:
items:
- description: Path leading to system memory
required:
- compatible
- qcom,freq-table
- qcom,bus-width
- "#cooling-cells"
- interconnects
additionalProperties: false
examples:
- |
#include <dt-bindings/interconnect/qcom,sc7280.h>
qcom,ddr-cdev {
compatible = "qcom,ddr-cooling-device";
qcom,freq-table = <200000>,
<451000>,
<768000>,
<1017000>,
<2092000>,
<2736000>;
qcom,bus-width = <4>;
#cooling-cells = <2>;
interconnects = <&mc_virt MASTER_LLCC &mc_virt SLAVE_EBI1>;
};