dt-bindings: thermal: Add bindings for thermal devices
Add bindings for thermal devices on Sun Soc, converted to YAML format. Change-Id: Ie5c39b55055c8f4e2a581128afdc45399cfb0c31 Signed-off-by: Rashid Zafar <quic_rzafar@quicinc.com>
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69
bindings/thermal/qti-ddr-cdev.yaml
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69
bindings/thermal/qti-ddr-cdev.yaml
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# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
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%YAML 1.2
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---
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$id: http://devicetree.org/schemas/thermal/qti-ddr-cdev.yaml#
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$schema: http://devicetree.org/meta-schemas/core.yaml#
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title: Qualcomm Technologies, Inc. DDR Cooling Device
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maintainers:
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- Rashid Zafar <quic_rzafar@quicinc.com>
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description: |
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The DDR cooling device will be used to place a DDR frequency vote. This
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cooling device will be used in those cases where all the subsystem's are
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thermally throttled and DDR has to be operated with a minimum performance
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level. This cooling device vote can ensure the same.
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properties:
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compatible:
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const: qcom,ddr-cooling-device
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qcom,freq-table:
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$ref: /schemas/types.yaml#/definitions/uint32-matrix
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description: |
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List of available DDR frequencies.
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qcom,bus-width:
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description:
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Provides the bus width for DDR.
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$ref: /schemas/types.yaml#/definitions/uint32
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enum: [1, 4, 8]
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default: 4
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"#cooling-cells":
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const: 2
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description: |
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Must be 2. Needed for of_thermal as cooling device identifier.
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Please refer to <devicetree/bindings/thermal/thermal.txt> for
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more details.
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interconnects:
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items:
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- description: Path leading to system memory
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required:
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- compatible
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- qcom,freq-table
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- qcom,bus-width
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- "#cooling-cells"
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- interconnects
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additionalProperties: false
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examples:
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- |
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#include <dt-bindings/interconnect/qcom,sc7280.h>
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qcom,ddr-cdev {
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compatible = "qcom,ddr-cooling-device";
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qcom,freq-table = <200000>,
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<451000>,
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<768000>,
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<1017000>,
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<2092000>,
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<2736000>;
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qcom,bus-width = <4>;
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#cooling-cells = <2>;
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interconnects = <&mc_virt MASTER_LLCC &mc_virt SLAVE_EBI1>;
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};
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